Failure Modes and Mechanisms in Electronic Packages

by P Singh (Editor), Puligandla Viswanadham (Editor)

With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.

396 pages, Paperback

First published November 30, 1997